Equipment for automatically supplying wafers from a manually loaded cassette to the Chip Mount unit and discharging empty wafers.
| Size & Weight | 2020x920x1950, 600kg |
|---|---|
| Air Supply | 5~6 bar |
| Work Specifications | Cassette (13” Wafer) |
Defect Review System for Tray-loaded Chip Components
| Size & Weight | 1000(W) x 1500(L) |
|---|---|
| Air Supply | 5~6 bar |
| Tray Specifications | JEDEC Tray, 315x135, 7.6t or 11.2t, Product(Chip) size: 15x15, ~ 120x120 ( DEVICE ) |
Automatic Pneumatic EMC Supply System for PKG Molding
| Size & Weight | MASTER 810x1200x2000, 500kg / MODULE 665x1200x2100, 500kg Expandable modular design (Supports 1+ sets) |
|---|---|
| Air Supply | 5~6 bar |
| Loading Spec | Approx. 15 EA/min supply |